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LEAK - Exclusive Snapdragon 8 Gen 3 Chips Powering Galaxy Z Flip6 and Galaxy Z Fold6

Samsung Bets on Qualcomm for Next-Gen Foldables

LEAKS  Smartphones  May 23, 2024  Reading time: 2 Minute(s)

mdo Max (RS editor)


Samsung is making a decisive move for its upcoming foldable smartphones, the Galaxy Z Flip6 and Galaxy Z Fold6. According to a new report, the tech giant is exclusively sourcing Qualcomm's Snapdragon 8 Gen 3 chipsets for its next-generation flagships. This marks a departure from its previous dual chipset strategy, which involved using Exynos processors in some regions. The decision underscores Samsung's focus on performance consistency across its foldable devices, even as the company prepares for a summer launch.

 

Leaked Case Designs Hint at Final Device Appearance

Adding to the anticipation, leaked case designs have surfaced, revealing what might be the final designs for the Galaxy Z Flip6 and Galaxy Z Fold6. The leaks, sourced from a reputable third-party case manufacturer and highlighted by Roland Quandt, show that the Galaxy Z Flip6 maintains a design similar to its predecessor. Conversely, the Galaxy Z Fold6 is expected to feature slightly wider displays compared to the narrower screens of the Galaxy Z Fold5.

No More Dual Chipsets for Foldables

The South Korean outlet, The Elec, reports that Samsung will not use a dual chipset strategy for the Galaxy Z Flip6 and Galaxy Z Fold6. Despite earlier rumors suggesting otherwise, it appears that all units of these foldable devices will be equipped with the Snapdragon 8 Gen 3, even in regions where the Exynos 2400 is available for the Galaxy S24 series. This strategic shift is attributed to the lower sales volume of Galaxy Z series handsets compared to the Galaxy S series, making it economically unfeasible to develop variants with different chipsets.

 

Anticipation Builds for Summer Release

As Samsung gears up for the anticipated release of the Galaxy Z Flip6 and Galaxy Z Fold6 this summer, excitement is building among tech enthusiasts and consumers. While the official release is still about two months away, the leaked case designs provide a tantalizing glimpse into what Samsung's next-generation foldables might look like.

Samsung's decision to exclusively use Qualcomm's Snapdragon 8 Gen 3 chipsets in its upcoming foldable smartphones reflects a strategic emphasis on performance and uniformity. The leaked information add to the intrigue, offering early insights into the final appearance of the Galaxy Z Flip6 and Galaxy Z Fold6.

  

 IMAGES CREDITS: ROLAND QUANDT 

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